High-Speed & RF Design
Signal integrity and RF engineering for demanding communications hardware
Where signal integrity and electromagnetics determine whether your board works.
What This Service
Actually Covers
At high data rates and radio frequencies, layout is everything. We apply rigorous signal integrity analysis — impedance control, differential pair matching, via stub minimisation, return path management — alongside RF-specific techniques: antenna design, matching networks, ground pour strategy, and EMC pre-compliance design rules to ensure your board passes CE/FCC first time.
Expert Engineers
Projects Delivered
Client Satisfaction
Support Available
Everything Included
A detailed breakdown of every capability we bring to this engagement — no hidden scope.
Controlled impedance routing (50Ω, 90Ω, 100Ω differential)
Differential pair routing with length and skew matching
Via stub management (back-drilling, buried/blind vias)
RF trace routing, matching networks, and filter placement
Antenna design and optimisation (PCB trace, chip, external)
EMC pre-compliance design: stitching vias, slot avoidance, chassis coupling
Signal integrity simulation (pre- and post-layout)
Power delivery network (PDN) analysis and decoupling optimisation
How We Approach
This Service
A clear, structured methodology tailored specifically to this engagement.
SI/PI Specification
Define impedance targets, timing budgets, and EMC constraints for all high-speed and RF interfaces.
Pre-Layout Simulation
Model critical nets pre-layout to identify risk areas and define routing rules before a trace is drawn.
Layout with SI/RF Constraints
Execute layout with all SI/RF rules enforced — impedance-controlled traces, matched pairs, and proper ground management.
Post-Layout Verification & EMC Pre-Check
Post-layout simulation, EMC design rule audit, and preparation of a pre-compliance submission checklist.
Ideal For
Products with USB 3.x, PCIe, Ethernet, HDMI, or integrated RF — where first-pass EMC failure is not an option.
What You Receive
SI/RF-compliant PCB layout, simulation results, impedance reports, and EMC pre-compliance checklist.
Often Combined With
These services frequently complement High-Speed & RF Design in the same project.
Schematic Design & Capture
Accurate, review-ready schematics that translate your concept into a manufacturable circuit
Explore →Multi-Layer PCB Layout
Dense, signal-integrity-conscious board layout from 2-layer to 16+ layers
Explore →Prototype Fabrication Support
Managing fabrication and assembly of your first prototype boards end-to-end
Explore →More Services in
This Category
Explore the other specialised services we offer under PCB Design & Prototyping.
Schematic Design & Capture
Accurate, review-ready schematics that translate your concept into a manufacturable circuit
Multi-Layer PCB Layout
Dense, signal-integrity-conscious board layout from 2-layer to 16+ layers
DFM & DFA Review
Ensuring your board can be manufactured and assembled at the lowest cost
BOM Generation & Component Sourcing
A clean, sourced BOM with alternates — ready for procurement and production
Prototype Fabrication Support
Managing fabrication and assembly of your first prototype boards end-to-end
Ready to Start Your
High-Speed & RF Design Project?
Tell us about your project and we'll put together an honest, detailed proposal — no lengthy sales pitch.